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Ceramic Package Product List

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High-Performance Ceramic Package for Microwave and Millimeter Wave

High-Performance Ceramic Package for Microwave and Millimeter Wave

Ceramic package for microwave and millimeter-wave devices that achieves excellent frequency characteristics.

We offer standard ceramic packages for microwave and millimeter-wave devices manufactured by StratEdge, which achieve excellent frequency characteristics through our unique manufacturing methods and field-through design. Most packages can be easily sealed using a dedicated lid with pre-formed sealing material. We also provide packages that use special metal materials for the base plate to improve heat dissipation characteristics. 【Product Lineup】 ■ Ceramic Packages for Microwave and Millimeter-Wave - LPA Series: DC-23 GHz, with leads, drop-in type - SMX Series: Up to 16+ GHz, with leads, surface mount type - SE50 Series: DC-50+ GHz, leadless, drop-in type - MC Series: DC-12+ GHz, with leads, molded ceramic - SM Series: Up to 26 GHz, QFN type hermetic package - LL Series: With leads, CMC power package * The downloadable PDF materials are the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

  • Ceramics
  • others
  • Ceramic Package

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Hygent Corporation [Ceramics Business]

Hygent Corporation [Ceramics Business]

Boldly challenge product development that supports next-generation communication networks with proprietary technology and proposal capabilities!

In addition to the glass hermetic metal packages adopted by many mainline optical communication repeaters, there is an increasing demand for high-frequency module packages that enable high-speed, large-capacity communication. By establishing technologies and facilities that cater to materials in both fields, Highgent is realizing optimal proposals tailored to applications. Armed with its cultivated ceramics manufacturing technology and know-how in bonding technology, the company is actively challenging the next-generation communication field and developing various products through custom-made solutions in areas beyond optical communication. For more details, please contact us or refer to our catalog.

  • Processing Contract
  • Ceramic Package

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[Processing Technology Example] Sharp Angle Conical CAP for Crystal, SAW, and Sensors

[Processing Technology Example] Sharp Angle Conical CAP for Crystal, SAW, and Sensors

Ni and Au plating available! The shape can minimize the inner radius.

The "CAP" formed in a tapered shape with the purpose of shifting the hollow part of the ceramic package to the lid side can secure a larger internal volume by adopting an acute angle shape. By transitioning from a multilayer to a single layer, it is possible to reduce package costs. The tapered shape allows for minimizing the inner radius. Additionally, it is effective for ultra-small types such as those below 1210 type, allowing for a cavity on the metal side. 【Processing Technology Examples】 ■ Possible to reduce package costs (multilayer ⇒ single layer) ■ Possible to minimize the inner radius with a tapered shape ■ Compact package size ■ Secure adhesive area ■ Compatible with Ni and Au plating *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Processing Contract
  • Other electronic parts
  • Ceramic Package

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